High-power lasers operating at 1 μm wavelength
Time:2024-12-27
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High-power lasers operating at 1 μm wavelength, including fiber lasers, diode pumped solid-state (DPSS) lasers, and direct-diode lasers, are increasingly deployed in highly automated manufacturing lines. They enable a wide range of materials processing applications such as welding, cutting, brazing, cladding, surface treating, bulk material heating, highly localized heating, and additive manufacturing. Optimal laser designs can be achieved with the proper selection of semiconductor lasers, specialized optics, and thermal-management solutions.
BoxOptronics‘ provides one of the broadest portfolios of merchant components for all 1 μm laser systems designed for industrial applications. These include high-power optics,coatings and fiber-based components for fiber lasers; nonlinear optical crystals; and neodymium-doped laser crystals for DPSS lasers.
BoxOptronics‘ semiconductor laser sources range from individual laser diode chips to laser bars and stacks to direct-diode laser engines. A broad range of laser diode wavelengths are available to accommodate various pumping schemes for fiber lasers and DPSS lasers, or to match workpiece material absorption characteristics when used in direct-diode lasers. BoxOptronics‘ high-power laser processing heads for cutting, welding, brazing, surface treatment, and cladding can be integrated into turnkey systems and deployed along with BoxOptronics‘ high-power laser light cables and fiber-fiber couplers.
BoxOptronics‘ provides one of the broadest portfolios of merchant components for all 1 μm laser systems designed for industrial applications. These include high-power optics,coatings and fiber-based components for fiber lasers; nonlinear optical crystals; and neodymium-doped laser crystals for DPSS lasers.
BoxOptronics‘ semiconductor laser sources range from individual laser diode chips to laser bars and stacks to direct-diode laser engines. A broad range of laser diode wavelengths are available to accommodate various pumping schemes for fiber lasers and DPSS lasers, or to match workpiece material absorption characteristics when used in direct-diode lasers. BoxOptronics‘ high-power laser processing heads for cutting, welding, brazing, surface treatment, and cladding can be integrated into turnkey systems and deployed along with BoxOptronics‘ high-power laser light cables and fiber-fiber couplers.
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